News Release
Carlisle, Pennsylvania -- P.R. Hoffman Machine Products announces the development and introduction of asymmetrical Lapping and Polishing processes. This breakthrough technology was developed to address specific and exacting requirements of the Semiconductor and Telecommunication industries to remove material from one side of a substrate while minimally affecting the opposite side of the product.
Conventional single-side lapping and polishing techniques normally do not improve substrate flatness and thickness variation significantly. The P.R. Hoffman asymmetric lapping and polishing processes are capable of improving the flatness and thickness variation due to the unique freedom of motions associated with the double-sided planetary lapping and polishing machines. These innovative processes allow asymmetric removal ratios as great as 90:1 .
Applications for these unique processes include silicon wafers, Epi wafers, SOI, MEMS, hybrid material combinations, fusion bonded wafers, quartz and sapphire crystals, and other Semiconductor materials. Reclaim of wafers can greatly benefit with minimal removal on back-side and better flatness than single-side polishing
The unique three-way, precision-controlled P.R. Hoffman 
series of machines is capable of these specialized processes in addition to symmetrical material removal. The P.R. Hoffman models 1500, 1900, 3100 and NEW 5400 are especially suited to thin and fragile substrates. This family of machines uses velocity servomotors to precisely control the three-way planetary motions as well as a servomotor for precise control of down force.
New Diamond-Pellet Grinding "Rapid-Removal-System" is now available for the series of machines. Click for Diamond Pellet Grinding Brochure (on literature page).
For more information please contact our engineering department:
An AMTECH SYSTEMS Co.
1517 Commerce Ave. Carlisle, PA 17015
Phone: +1 717-243-9900 Fax: +1 717-243-4542
http://www.prhoffman.com/ E-mail: prhoff@prhoffman.com